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  • Underfill

    Location:Home > Products > Underfill > Text
    The underfill adhesive is one compnent,low viscosity,low tenperature heat curing. It has excellent electrical properties, weather resistance, and chemical resistance.

    Mainly be used in phone/touch screen/PDA/computer motherboard industry,has excellent structural bonding effect.
    Technical Date Sheet


    Product
    Number

    Color

    Viscosity
    (mPa.s)

    Tg℃

    Whether Can Repair

    The curing conditions
    Minutes / temperature

    (Mpa)Shear Strength

    packing

    Product Application

    JLD-5351

    Black

    375

    69

    yes

    15/120
    10/130

    5

    30ML
    50ML

    CSP,BGA universal,low viscosity,Good liquidity,flowing in room temperature,good permeability,easy to repair.

    JLD-5352

    Black

    1800

    53

    yes

    5/120
    2/130

    8

    30ML
    50ML

    CSP,BGA,Epoxy-based materials,high strength,Earthquake resistance,good stability,used in notebook computers, mobile phones and other industries.

    JLD-5354

    Brown

    4300

    110

    no

    15/120
    30/130

    10

    30ML
    50ML

    CSP,BGA,Epoxy-based materials,high strength,Earthquake resistance,good stability,used in notebook computers, mobile phones and other industries.

    JLD-5354

    Black

    360

    113

    no

    15/120
    10/130

    6

    30ML
    50ML

    CSP,BGA universal,low viscosity,good liquidity,flowing in room temperature.It is used in mobile electronic component adhesive filling .

    JLD-5355

    Opal

    4500

    68

    no

    15/120
    12/150
    30/100

    8

    30ML
    50ML
    250ML

    CSP,BGA,Epoxy-based materials,high strength,Earthquake resistance,good stability,used in notebook computers, mobile phones and other industries.

     Notice: Underfill adhesive can be customized.

    Update Time:2014-03-31 16:25:25Hit:6174Size:T|T
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